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Tech & Science
Samsung has unveiled a 900-layer V-NAND prototype utilizing Cell Multi-Bonding, marking a research milestone rather than a commercial product.
Samsung has successfully developed a prototype of a 900-layer V-NAND chip by employing a method called Cell Multi-Bonding (CMB), which fuses two 450-layer memory stacks into a single unit. This breakthrough was confirmed by ETNews amid rising demand for high-density storage solutions in AI servers and data centers. However, this innovation remains a research prototype and is not yet intended for commercial SSDs.
The Cell Multi-Bonding technique physically bonds two complete 450-layer stacks, avoiding the traditional approach of adding more layers vertically. Samsung states this method addresses persistent manufacturing challenges such as wafer warpage and layer misalignment, issues that intensify with increasing layer counts. Additionally, Samsung has optimized its Bitline and Wordline designs to reduce the chip's size and power consumption.
While the 900-layer chip represents a significant research achievement, Samsung's immediate production focus is on the V10 generation, which features over 400 layers and is slated for mass production in the second half of 2026. The 900-layer prototype signals the company's long-term technological direction, with plans to reach 1,000-layer NAND by 2030. Analysts at TechGenyz interpret this development as Samsung's strategic response to competition from Chinese manufacturers.
Samsung faces strong competition in the NAND market. SK Hynix has already commenced commercial production of 321-layer QLC NAND chips since the latter half of 2025. These chips offer a 2Tb capacity, twice the write speed, and 23% improved power efficiency compared to previous models and are currently integrated into enterprise SSDs, giving SK Hynix a production lead.
Meanwhile, China's YMTC has shipped 294-layer NAND chips within consumer devices and plans to mass-produce 300-plus-layer NAND in 2026 despite US export restrictions limiting access to advanced chipmaking equipment. Major cloud service providers such as Apple, Microsoft, and Google are closely monitoring supply developments, placing greater emphasis on actual shipment volumes expected in the second half of 2026 rather than prototype announcements.
The introduction of the 900-layer prototype does not affect current consumer SSD options. Enterprise SSD pricing and availability during 2026 and 2027 will depend more on Samsung's ability to ramp up V10 production on schedule and SK Hynix's maintenance of its production advantage. Although the CMB prototype demonstrates Samsung's viable approach to achieving extremely high layer counts, the distinction between a credible development path and commercially available products remains significant.
